Awards per year
NSF TIP Awards
- 2 Finished
-
SBIR Phase II: Low-Cost Packaging Solution for Space-Grade and High-Reliability Integrated Circuits
Ghoshal, A. (PI)
12/01/23 → 11/30/25
Project: Research
-
STTR Phase I: Low-Cost Packaging Solution for Space-Grade and High-Reliability Integrated Circuits
Ghoshal, A. (PI) & Ryu, I. (Former PI)
12/15/21 → 12/31/22
Project: Research